Hi-Bond

Hi-Bond” is an 8th-generation bonding agent that was published in Nature in 2024. It offers convenience with a one-bottle system that combines etching, primer, and bonding in one product. “Hi-Bond” is compatible with total etching, self-etching, and selective etching, making it suitable for a wide range of dental treatments. Additionally, it utilizes our proprietary technology to deliver excellent performance as a desensitizing agent and provides superior remineralization effects. The product is FDA-approved, and CE (MDR) registration is currently in progress.